400
FIGURE 1.1 - TYPICAL HSPP CONFIGURATION
401
2x10 MB/s
£5 ) GENERAL CLUSTER CLUSTER CLUSTER
CN] PURPOSE OF OF OF
MICRO 0SP's DSP's DSP's
"1 >. di. pu i. i. ib. A
Ed DL EX L is : i á i : .
ACTIVE |__| PASSIVE ACTIVE | PASSIVE || ACTIVE [| PASSIVE ACTIVE || PASSIVE
Sus L| sus BUS Bus Lf BUS | Bus BUS BUS -
INTERFACE INTERFACE INTERFACE INTERFACE INTERFACE INTERFACE INTERFACE INTERFACE
ACTIVE LLL] PASSIVE ACTIVE |! PASSIVE PASSIVE PASSIVE
BS Ld BUS gus TT S aus 8US
INTERFACE INTERFACE INTERFACE INTERFACE INTERFACE INTERFACE
a Yt 2. - I >
m 4 + > + + e
CAMERA FFT
COUPLER MEMORY PROCESSOR
TUE
FIGURE 1.2 - HSPP IMPLEMENTATION OF SAR PROCESSING (SPARE PROCESSORS MOT SHON)
Auxilliary Gata
Input Data Input Data
Flow INPUT INPUT CLUSTER PP low
— ipi. COUPLER COUPLER GF COUPLER 1 — >
38.4 MB/s $ OSP's 1.5 NB/s
éme € —M 1 Ed I
EX x T58 | EX x 155 | = 5 I |
ABI, Lui ABIg ABI
PBI; PBI; 4 1 P812g
H
CLUSTER CLUSTER CLUSTER MEAN OUTPUT
OF oF eee e ee um um uh wo om c m um m m mm sd OF DOPPLER COUPLER
8 OPS's 8 DSP's 8 DSP's PROCESSOR
To Control
Unit
function subfunction parts list no. of no. of | no, of power weight per
parts identical parts | consumption function
functions (u) (kg)
input ABI semi custom chip i 11 3.0
giue chios 7 li 7 2.1 9.7
8Kx8 bits (mos Ram 2 22 9.5
azimuth PBI semi custom 1 } 23 23 8.6
MCTM + RCTM give chips 7 181 4.4
MCTM + RCTM 8Kx8 bits Cmos Rím 80 1260 1.9 22
cluster of 8 DSP's | TMS - 320 8 2 168 144.0
glue chips, Ram's, Rom's 80 1580 40
deskew + output ABI semi custom 1 2 0.6
glue chips 7 14 0.4
8Kx8 bits Cmos Ram 8 16 9.1
2 2
Cluster of 8 DSP's | TMS - 320 $ 1 5.4
glue chips, Ram's, Rom's 80 180 2.0
output glue chips 20 | 40 3.0 i
TOTAL a 3650 |^ 210 ~ 25
Table 3 - Mass and power consumotion budget (excl.
mean Doppler processor)
