Full text: Fortschritte in der Metallographie 

391 
A - Au/Sn-Lot 
SE 30 nm Ti 
EEE 0.nm Ni 
/ esse 100m WSixNy 
2 
mm 810» 
Se 30 nm. Ti 
00 nm WSIxNy 
2272 275 nm Au 
Hr" A() nm PI 
Fa -nm Ti 
. nn InP 
Bild 2: Schichtenfolge der Unterbumpmetallisierung
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