Full text: Fortschritte in der Metallographie

Prakt. Met. Sonderband 46 (2014) 269 
bably, due to The origin microstructure of NiTi alloy, before carburizing is homogeneous and has acicular 
like morphology (fig. 2a). Meanwhile, after carburizing, in the surface layer of the alloy, the 
concentration profile of Ti, Ni and C was build up (fig. 3a,b). The intensity of Ti Ka line, firstly 
slightly decreases from the center part of the matrix to the TiNi/TiC interface and finally 
strongly increases in the TiC layer. The intensity of Ni Ka line shows firstly constant 
concentration profile of Ni in the surface layer of the matrix and drastic decrease of 
concentration in the TiC layer. Finally, the intensity of C Ka. line is weak in the TiNi matrix, 
corresponding probably to the surface contamination of the sample, but when reaching the 
TiC layer the intensity of C Ka line increases, which proves that the TiC layer was formed 
on the surface of the sample during vacuum carburizing. The TiC layer is uniform and about 
5 um thick (fig. 2b). 
(a) ta=6 min, 
=10 mbar 
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Fig. 3: The EDX line scan analysis (dashed line) of vacuum carburized NiTi wire at 
1000°C, ta=6 min, pc,H,=10 mbar 
Consequently, the microstructure of the surface layer of the alloy becomes after vacuum 
carburizing heterogeneous, consisting of matrix and numerous precipitates with different 
morphological forms (fig 2b, 2c). With SEM/EDX analysis, we found out, that the matrix has 
acicular morphology formed probably by eutectoid reaction and consisting of Ti2Ni and TiNis 
phases [12]. The round precipitate corresponds to the TisNis phase and the oblong one to 
the TiNis phase, respectively [13]. The precipitates of TiNis phase could also be found on 
the grain boundaries (fig. 2c) [14]. 
4. CONCLUSIONS 
In this research work was shown, that vacuum carburizing technology which is in general 
ing (b, c) at used for case hardening of steels, can also be successfully applied in the field of NiTi shape 
memory alloys for improvement of wear resistance. At optimal process parameters. a 
; Ti Ka 
Ni Ka 
C Ka
	        
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