Prakt. Met. Sonderband 47 (2015) 7 
8. For the 
le sui 
10]. 
Otality and 
Ie intereop. 
Stack with a 
; and failure Fig. 4: (left) Cross-section through a 3D stack, X-ray microscopy and (right) high-resolution X-ray rendering of tomog- 
n all void in raphy data of a AgSn micro solder bump. 
1m 5D TSV 
cisely from 
information, 
determined. 
ACES DIOCESS 
n particular, 
5, target FIB 
m res 
nr urves potrnm 
ig the vo 
qupeame” 
Fig. 5: Visualization of filling defects (voids) in the center of a TSV: Scheme, virtual vertical cross-section based on 
nano X-ray tomography and SEM image of a FIB cross-section through the region of interest [11,12].