Full text: Fortschritte in der Metallographie

52 Prakt. Mef. Sonderband 52 (2018) 
[10] Z. Li, A. Ludwig, A. Savan, H. Springer, D. Raabe (2018) Combinatorial metallurgical 
synthesis and processing of high-entropy alloys, accepted by Journal of Materials 
Research } | Ü . } 
[11] S. Borhani-Haghighi, M. Kieschnick, Y. Motemani, A. Savan, D. Rogalla, H.-W. 
Becker, J. Meijer, A. Ludwig (2013), High-Throughput Compositional and Structural 
Evaluation of a Lia(NixMnyCo;)Or Thin Film Battery Materials Library, ACS Comb. Sci., 
15, 401-409 | N | DE | 
[12] C.J. Long, D. Bunker, X. Li, V. L. Karen, |. Takeuchi, (2009) Rapid Identification of 
Structural Phases in Combinatorial Thin-Film Libraries Using X-Ray Diffraction and 
Non-Negative Matrix Factorization. Rev. Sci. Instrum., 80 (10), 103902-103906. 
[13] H.S. Stein, S. Jiao, A. Ludwig (2017). Expediting combinatorial dataset analysis by 
combining human and algorithmic Analysis, ACS Comb. Sci., 19, 1-8 | 
[14]. S. Thienhaus, S. Hamann, A. Ludwig (2011), Modular high-throughput test-stand for 
versatile screening of thin-film materials libraries, Sci. Technol. Adv. Mater. 12 
054206 : 
[15] R. Zarnetta, S. Kneip, Ch. Somsen, A. Ludwig (2011), High-throughput 
characterization of mechanical properties of Ti-Ni-Cu shape memory thin films at 
elevated temperatures; Materials Science and Engineering A 528, 6552— 6557. 
[16] Y.W. Lai, S. Hamann, M. Ehmann, A. Ludwig (2011), High-throughput 
characterization of stresses in thin film materials libraries using Si cantilever array 
wafers and digital holographic microscopy, Review of Scientific Instruments 82, 
063903. 
[17] D. Grochla, L. Banko, J. Pfetzing-Micklich, H. Behm, C. Hopmann, A. Ludwig (2018) 
Si micro-cantilever sensor chips for space-resolved stress measurements in physical 
and plasma-enhanced chemical vapour deposition, Sensors and Actuators A 270, 
271-277 
[18] D. Grochla, A. Siegel, S. Hamann, P. J. S. Buenconsejo, M. Kieschnick, H. Brunken, 
D. Konig, A. Ludwig (2013), Time- and space-resolved high-throughput 
characterization of stresses during sputtering and thermal processing of Al-Cr-N thin 
films, J. Phys. D: Appl. Phys. 46, 084011 So | 
[19] A. Ludwig, J. Cao, J. Brugger, I. Takeuchi (2005), MEMS tools for combinatorial 
materials processing and high-throughput characterization, Meas. Sci. Technol. 16, 
111-118. 
[20] S. Thienhaus, D. Naujoks, J. Pfetzing-Micklich, D. Kénig, A. Ludwig (2014) Rapid 
Identification of Areas of Interest in Thin Film Materials Libraries by Combining 
Electrical, Optical, X-ray Diffraction, and Mechanical High-Throughput 
Measurements: A Case Study for the System Ni-Al, ACS Comb. Sci. 16, 686-694 
[21] K. Sliozberg, D. Schéfer, T. Erichsen, C. Khare, R. Meyer, A. Ludwig, Wolfgang 
Schuhmann (2015), High-throughput screening of thin-film semiconductor materials 
libraries I: System development and case study for Ti-W-O, ChemSusChem, 8, 1270 
— 1278 
[22] R. Meyer, K. Sliozberg, C. Khare, W. Schuhmann, A. Ludwig (2015), High-throughput 
screening of thin-film semiconductor materials libraries II: Characterization of Fe-W- 
~~ O Libraries, ChemSusChem 8, 1279 — 1285 | I 
[23] R. Gutkowski, C. Khare, F. Conzuelo, Y.U. Kayran, A. Ludwig, W. Schuhmann (2017) 
Unraveling Compositional Effects on the Light-Induced Oxygen Evolution in Bi(V-Mo-- 
~ X)O4 Material Libraries, Energy & Environmental Science, 10, 1213 - 1221 f 
[24] P. Decker, D. Naujoks, D. Langenkaemper, C. Somsen, A. Ludwig (2017) High- 
throughput structural and functional characterization of the thin film materials system 
Ni-Co-Al, ACS Combi. Sci. 19. 618-624
	        
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